Protective structure

ABSTRACT

A protective structure may include: a semiconductor substrate having a doping of a first conductivity type; a semiconductor layer having a doping of a second conductivity type arranged at a surface of the semiconductor substrate; a buried layer having a doping of the second conductivity type arranged in a first region of the semiconductor layer and at the junction between the semiconductor layer and the semiconductor substrate; a first dopant zone having a doping of the first conductivity type arranged in the first region of the semiconductor layer above the buried layer; a second dopant zone having a doping of the second conductivity type arranged in a second region of the semiconductor layer; an electrical insulation arranged between the first region and the second region of the semiconductor layer; and a common connection device for the first dopant zone and the second dopant zone.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of application Ser. No. 13/566,039,filed on Aug. 3, 2012, now U.S. Pat. No. 8,531,011, which is acontinuation of application Ser. No. 12/958,929, filed on Apr. 12, 2011,now U.S. Pat. No. 8,263,481, which is a continuation of application Ser.No. 12/120,401, filed on May 14, 2008, now U.S. Pat. No. 7,888,232,which claims priority to German Patent Application Serial No. DE 10 2007024 355.5, which was filed May 24, 2007, all of which are herebyincorporated herein by reference in their entirety.

FIELD OF THE INVENTION

Exemplary embodiments of the invention relate to a method for producinga protective structure, and the protective structure.

BACKGROUND OF THE INVENTION

Electrostatic discharges (ESD) can severely damage semiconductorcomponents. Therefore, ESD protective concepts are realized in mostsemiconductor components nowadays. The ESD protective componentsintegrated in the chip define a current path via which the ESD currentcan flow without causing damage.

In the case of high-speed data transmission lines, in particular, therequirement exists of ensuring an ESD protection up to 15 kV without thesignal waveform being distorted to an excessively great extent. For thispurpose, the protective element must have a particularly lowcapacitance.

Known ESD protective structures have structures that are complicated andhave inaccurate producability on account of the high substrate thicknessfor the diode arrangement. The dopant diffusion through the completesubstrate thickness leads to inaccuracies and a high space requirementowing to the lateral outdiffusion that likewise takes place. The highsubstrate thickness brings about a high resistance, which adverselyaffects the performance of the protective structure.

BRIEF DESCRIPTION OF THE FIGURES

Exemplary embodiments of the invention are explained in more detailbelow, referring to the accompanying figures. However, the invention isnot restricted to the embodiments described in concrete fashion, butrather can be modified and adapted in a suitable manner. It lies withinthe scope of the invention to combine individual features and featurecombinations of one embodiment with features and feature combinations ofanother embodiment in a suitable manner in order to attain furtherembodiments according to the invention.

In the figures:

FIG. 1 shows a schematic cross-sectional view of a protective structure,and

FIG. 2 shows a schematic cross-sectional view of a further embodiment ofthe protective structure.

DETAILED DESCRIPTION OF THE INVENTION

The present invention specifies a cost-effective method for producing aprotective structure having a high performance.

Embodiments of the invention generally relate to a method for producinga protective structure which involves providing a semiconductorsubstrate with a doping of a first conductivity type, applying asemiconductor layer with a doping of a second conductivity type at asurface of the semiconductor substrate, forming a buried layer with adoping of a second conductivity type in a first region of thesemiconductor layer, wherein the buried layer is produced at thejunction between the semiconductor layer and the semiconductorsubstrate, forming a first dopant zone with a doping of a firstconductivity type in the first region of the semiconductor layer abovethe buried layer, forming a second dopant zone with a doping of a secondconductivity type in a second region of the semiconductor layer, formingan electrical insulation between the first region and the second regionof the semiconductor layer, and forming a common connection device forthe first dopant zone and the second dopant zone.

By forming an adapted semiconductor layer, it is possible for thethickness of said semiconductor layer to be restricted to the bareessentials. A small semiconductor layer thickness, however, permits areduction of the structure widths and lengths, in particular by virtueof shorter process times such as e.g. outdiffusions, which leads to costsavings.

Moreover, the resistance of a current flowing through the protectivestructure is lowered by a small semiconductor layer thickness, whichmeans a low clamping voltage and therefore improves the performance ofthe protective structure.

Embodiments of the invention specifically relate to a method forproducing a protective structure which involves providing asemiconductor base substrate with a doping of a first conductivity type,producing a first epitaxial layer on the semiconductor base substrate,implanting a dopant of the second conductivity type in a delimitedimplantation region of the first epitaxial layer, applying a secondepitaxial layer with doping of a second conductivity type on the firstepitaxial layer, forming insulation zones in the second epitaxial layer,such that the second epitaxial layer is subdivided into a first regionand into a second region, producing a first dopant zone with a doping ofa first conductivity type in the first region above the implantationregion, producing a second dopant zone with a doping of a secondconductivity type in the second region, outdiffusing the dopant from theimplantation region in order to form a buried layer at the junctionbetween the first epitaxial layer and the first region of the secondepitaxial layer.

By means of the first epitaxial layer, in particular by means of thethickness thereof, it is possible to adapt to the requirements thejunction between first and second conductivity type in the firstepitaxial layer, especially with regard to the breakdown voltage of thePN junction.

The thickness of the second epitaxial layer once again determines thecosts and the performance of the protective structure, which can lead toimprovements through corresponding adaptation of the second epitaxiallayer.

Before the exemplary embodiments of the present invention are explainedin more detail below with reference to the figures, it is pointed outthat identical elements in the figures are provided with identical orsimilar reference symbols, and repeated description of said elements isomitted.

FIG. 1 illustrates a first embodiment of a protective structure 100produced according to the method according to the invention. Asemiconductor layer 120 is applied on a surface of a semiconductorsubstrate 110 provided, said substrate having a doping of a firstconductivity type. The semiconductor layer 120 has a doping of a secondconductivity type. The dopant concentration of the semiconductor layer120 is kept as low as possible in order to achieve a minimal capacitivedisturbing effect of the protective structure. Therefore, the dopantconcentration of the semiconductor layer should not exceed 1*10¹⁵ cm⁻³.The semiconductor layer 120 is produced epitaxially, for example. Inparticular, the semiconductor layer 120 is produced with a thickness d1of 2 μm≦d1≦20 μm.

The semiconductor substrate 110 has a dopant concentration of at least1×10¹⁸ cm⁻³, while the semiconductor layer 120 is produced with a lowerdopant concentration than the semiconductor substrate 110.

A buried layer 140 with a doping of a second conductivity type is formedin a first region 150 of the semiconductor layer 120. The buried layer140 is produced at the junction 170 between the semiconductor layer 120and the semiconductor substrate 110. This is done for example byimplantation of a dopant at the surface of the semiconductor substrate110 and subsequent outdiffusion of the dopant into the semiconductorlayer 120.

As an alternative, the dopant can also be provided in the form of adeposited layer on the semiconductor substrate 120.

The provision of dopant for the buried layer 140 is generally effectedbefore the semiconductor layer 120 is produced on the semiconductorsubstrate 110. In this case, the buried layer 140 is formed with ahigher dopant concentration that the semiconductor layer 120.

The annealing of the dopants in order to form the buried layer iseffected over a time period of 1≦t≦30 minutes at a temperature T of1000° C.≦T≦1200° C., in particular 5 minutes at 1150° C.

As dopant for the buried layer 140, boron is appropriate as P-typedopant and As, P are appropriate as N-type dopant.

The buried layer 140 with a dopant of a second conductivity type formstogether with the semiconductor substrate 110 a PN junction, that is tosay a diode, in particular a TVS (transient voltage suppressor) diode.

Above the buried layer 140, a first dopant zone 180 with a doping of afirst conductivity type is formed in the first region 150 of thesemiconductor layer 120. For this purpose, by way of example, the dopantis implanted into the semiconductor layer 120 and subsequently activatedand outdiffused. The outdiffusion takes place over a time period t2 ofapproximately 10 seconds at 950° C. in order to obtain a first diffusionzone 180 that is as narrow as possible.

Part of the semiconductor layer 120 remains between the first dopantzone 180 and the buried layer 140. The layer sequence composed of afirst dopant zone 180 with a doping of a first conductivity type,semiconductor layer 120 with a very low doping of a second conductivitytype and buried layer 140 with a doping of a second conductivity typeforms a PIN or NIP diode, The buried layer 140 is therefore used firstlyas part of the PIN/NIP diode and secondly as part of the TVS diode.PIN/NIP diode and TVS are connected in series in this case.

A second dopant zone 190 with a doping of second conductivity type isformed in a second region 160 of the semiconductor layer 120. Theformation can likewise be effected by implantation of a dopant andsubsequent activation and outdiffusion of the dopant. The outdiffusiontime is once again set in such a way that a second dopant zone 190 thatis as narrow as possible arises. This saves time, space and thus alsocosts.

The second dopant zone 190 is produced in the same way as the firstdopant zone 180 at that side of the semiconductor layer 120 which isnear the surface. Consequently, part of the semiconductor layer 120 alsoremains between second dopant zone 190 and semiconductor substrate 110.As a result, the layer sequence of second dopant zone 190 with a dopingof the second conductivity type, semiconductor layer 120 with a very lowdoping of a second conductivity type and semiconductor substrate 110with a doping of the first conductivity type forms a PIN or NIP diode.

The first region 150 and the second region 160 are arranged alongsideone another in the semiconductor layer 120. Consequently, theseries-connected diode arrangement in the first region 150 is inparallel with the PIN/NIP diode in the second region. The PIN/NIP diodein the first region 150 is biased in the opposite direction to theNIP/PIN diode in the second region 160.

Electrical insulation structures 125 are formed in the semiconductorlayer 120, which insulation structures laterally delimit the firstregion 150 and the second region 160 and isolate them from one another.In this case, the electrical insulation 125 is formed with a depth suchthat it extends from the surface of the semiconductor layer 120 at leastas far as the semiconductor substrate 110 through the semiconductorlayer 120. The electrical insulation 125 can be produced in a mannerthat is all the more rapid and saves space all the more, the smaller thelayer thickness d1 chosen for the semiconductor layer 120.

By way of example, the electrical insulation 125 is produced byimplantation and outdiffusion of a dopant of a first conductivity type.Since the outdiffusion is intended to be effected through the entiresemiconductor layer 120, long diffusion times are necessary in the caseof a large semiconductor layer thickness d1. In this case, the dopantwill also out diffuse laterally, which leads to a significant wideningof the structures and the space requirement therefore rises. Longproduction times and a large space requirement are critical factors forhigher costs, however. Therefore, the layer thickness d1 of thesemiconductor layer should be kept as small as possible. On the otherhand, the parasitic capacitance of the PIN/NIP diodes is increased by asmall layer thickness, which leads to higher disturbing influences suchas e.g. distortions of the signals in the application of the protectivestructure. Consequently, the thickness d1 of the semiconductor layermust be chosen in such a way as to achieve a compromise betweencapacitance and production costs. This compromise currently lies at alayer thickness d1≅8 μm. For the outdiffusion of the dopant through thesemiconductor layer 120, diffusion times of 60 minutes at a diffusiontemperature of 1150° are necessary for this.

As an alternative, the electrical insulation 125 can also be produced byproducing a trench through the semiconductor layer 120. Said trench canin particular also be at least partly filled with electricallyinsulating material. In this case, too, the dimension of the trench isinfluenced by the layer thickness d1 of the semiconductor layer 120. Inorder to produce a deep trench, the width of the trench has to beincreased. Consequently, a thick semiconductor layer also affects thewidth of the trench, which leads to a higher space requirement for theinsulation and therefore likewise increases the costs.

A common connection device 135 is formed for the first dopant zone 180and the second dopant zone 190. This is done for example by producing aninsulation layer 145, such as an oxide layer, for example, on thesemiconductor layer 120. In said insulation layer 145, openings areformed above the first dopant zone 180 and above the second dopant zone190. The electrically conductive connection structure 135, such as ametal layer or a polysilicon layer, for example, is then produced on theinsulation layer 145 and in the openings. The connection device 145therefore makes contact with the first dopant zone 180 and the seconddopant zone 190.

FIG. 1 schematically outlines a circuit in order to illustrate thefunctioning of the protective structure. If a negative voltage ispresent for example at the input node I/O then the current will flowaway to ground GND via the PIN diode of the second region 160. Bycontrast, if a positive voltage is present at the I/O, then the PINdiode of the second region 160 is reverse-biased and the current isconducted through the forward-biased PIN diode in the first region 150.However, a current will flow only when the voltage of the initiallyturned-off TVS diode exceeds the threshold voltage. As soon as saidvoltage is exceeded, the TVS diode starts to conduct and the current canflow away via the first region 180 to the ground connection GND at therear side of the semiconductor substrate 110. Consequently, the circuitin which the protective structure 100 is integrated is protected againstover voltages that are greater than the threshold voltage of the TVSdiode.

FIG. 2 shows a further embodiment of a protective structure according tothe invention.

The protective structure 200 has developments of the protectivestructure 100 from FIG. 1. Thus, by way of example, the semiconductorsubstrate 110 is composed of a semiconductor base substrate 210 and anintrinsic layer 220 produced thereon.

The intrinsic layer 220 is produced epitaxially, for example, and has noor only a very low doping of an arbitrary conduction type.

By contrast, the semiconductor base substrate 210 has a very high dopingwith a dopant of a first conductivity type. Subsequent thermal stepscause the doping to out diffuse from the semiconductor base substrate210 into the intrinsic layer 220.

In this case, the intrinsic layer 220 acts as a buffer layer for theoutdiffusion from the semiconductor base substrate 210. The thicker theintrinsic layer 220, the further the dopant out diffuses from thesemiconductor base substrate 210 to the pn junction. As a result, thejunction takes place at lower, flatter doping profiles, which leads toan increase in the breakdown voltage. Consequently, the breakdownvoltage of the TVS diode can be set by the thickness of the intrinsiclayer 220.

Moreover, the electrical insulation is produced in a two-part process inthe protective structure 200 as a development of the protectivestructure 100. In this case, firstly a dopant is implanted into thesemiconductor substrate 110. After the semiconductor layer 120 has beenproduced, dopant is once again implanted, but now into the semiconductorlayer 120. The dopant is subsequently outdiffused, which leads to theformation of two dopant regions 125′ and 125″ lying one above another,which together produce the electrical insulation 125. As a result, it ispossible to produce for example deeper electrical insulation 125 rightinto the semiconductor substrate 110.

A further development of the method according to the invention is thatat least one connecting zone 230 is formed between the connection device135 and the buried layer 140. Consequently, the buried layer can beallocated a bias voltage, for example. For this purpose, the connectingzone 230 is formed for example with a dopant of a second conductivitytype and with a dopant concentration k_(v)>1×10¹⁷ cm⁻³. Moreover, theconnecting zone can be formed in two-part form with two zones 230′ and230″ lying one above another.

Moreover, the protective structure 200 has by comparison with theprotective structure 100 the development that a metallic layer 240 isproduced at the rear side of the semiconductor substrate 110, whichmetallic layer can be used as a substrate connection.

However, the substrate connection can also be led to the surface via theelectrical insulation 125 (p-type sinker), whereby for example a WLPpackage also becomes possible.

All the developments in the protective structure 200 can be madeindividually or in combination, which respectively leads to furtherembodiments of the invention.

As already explained with regard to FIG. 1, FIG. 2 once again shows theschematic circuit diagram with the diodes forming the protectivestructure.

What is claimed is:
 1. A protective structure comprising: asemiconductor substrate having a doping of a first conductivity type; asemiconductor layer having a doping of a second conductivity typearranged at a surface of the semiconductor substrate; a buried layerhaving a doping of the second conductivity type arranged in a firstregion of the semiconductor layer and at the junction between thesemiconductor layer and the semiconductor substrate; a first dopant zonehaving a doping of the first conductivity type arranged in the firstregion of the semiconductor layer above the buried layer; a seconddopant zone having a doping of the second conductivity type arranged ina second region of the semiconductor layer; an electrical insulationarranged between the first region and the second region of thesemiconductor layer; a common connection device in direct contact withthe first dopant zone and the second dopant.
 2. The protective structureas claimed in claim 1, wherein the semiconductor layer has a dopantconcentration k≦1×10¹⁵ cm⁻³.
 3. The protective structure as claimed inclaim 1, wherein the semiconductor layer has a lower dopantconcentration than the semiconductor substrate.
 4. The protectivestructure as claimed in claim 1, further comprising an intrinsic layerarranged at the surface of the semiconductor substrate.
 5. Theprotective structure as claimed in claim 1, wherein the buried layer hasa higher dopant concentration than the semiconductor layer.
 6. Theprotective structure as claimed in claim 1, wherein the electricalinsulation is arranged from the surface of the semiconductor layer atleast as far as the semiconductor substrate.
 7. The protective structureas claimed in claim 1, further comprising at least one connecting zonearranged between the connection device and the buried layer.
 8. Theprotective structure as claimed in claim 1, wherein the semiconductorlayer has a thickness d1 of 2 μm≦d1≦20 μm.
 9. The protective structureas claimed in claim 4, wherein the intrinsic layer has a thickness d2 of0≦d2≦8 μm.
 10. The protective structure as claimed in claim 1, whereinthe electrical insulation comprises a trench at least partly filled withan electrically insulating material.
 11. The protective structure asclaimed in claim 1, wherein the electrical insulation comprises a dopantof the first conductivity type.